Senior IC Physical Failure Analysis Engineer

Overview

• NVIDIA Networking IC Product Engineering team is looking for a highly skilled IC physical failure analysis (PFA) engineer to join our growing team and support PFA activities for yield improvement, product bring-up, customer returns, and product qualification.
• As a PFA engineer, you will own the physical failure analysis (PFA) part, develop work procedures/techniques/recipes, and perform PFA of IC’s using in-house equipment and in external labs.
• What You Will Be Doing: Operate dual-beam PFIB and develop workflows for the following applications: Site-specific cross-sectioning TEM sample preparation IC delayer Large scale cross-sections Unique sample preparation for different probing and imaging techniques Use SEM based nanoprobing techniques for fault isolation and device/cell characterization based on FA plan provided by the EFA engineers EBAC/EBIC/EBRICH for fault isolation Device and cell level measurements Own and lead nanoprobing activities, including method development and execution.
• Continuously drive improvements, stay up-to date, and collaborate with vendors on new techniques.
• Sample preparation for optical fault isolation, probing and more: use P-lapping and CNC for Si thinning and IC delayering What We Need to See: BSc in Materials/chemical engineering, physics, chemistry, or related fields 5+ years of relevant industry experience in IC package or die level Failure Analysis.
• Ability to work and collaborate as part of a team and independently Self-motivated with the ability to learn alone and review the literature to find solutions to our challenges.
• Insist on high standards for high-quality samples Good documentation and communication skills Ways To Stand Out From The Crowd: Good understanding of VLSI circuit design, and/or device physics, and/or IC process engineering Experience with various IC delayering methods Background with dual beam FIB for cross-sections and preparing lamella for TEM Experience with SEM based nano-probing.