Senior Co-packaged Optics Process Engineer

Overview

• The NVIDIA Networking IC Co-Packaged Optics Engineering team is seeking an experienced Senior Optical Process Engineer for co-packaged optics products.
• This role involves close collaboration with various IC Product Engineering teams, including hardware, test engineering, and product engineering, as well as the Operations team and leading semiconductor vendors and assembly/test providers worldwide.
• The position requires a strong understanding of optical assembly process, active optical alignment equipment and processes to ensure stable, efficient, and smoothly running production line.
• This enables high availability while maintaining the quality of products shipped to customers.
• What you'll be doing: Ensure end-to-end assembly process readiness for CPO products at NV manufacturing partners.
• Collaborate closely with RnD, PE and Operations to ensure robust manufacturing capabilities and reliability of CPO products and assure mass production is running smoothly.
• Yield analysis monitoring and drive continues improvement initiatives for NPI production lines, ensure optimal yield and efficiency to achieve NVIDIA capacity and cost target.
• Maintain products’ quality by improving design and manufacturing process as well as equipment stability.
• Provide onsite engineering support: technical ownership and support for process or equipment issues.
• What we need to see: BS/MS degree in Mechanical Engineering, Optical Engineering, Material Science and/or related field.
• 5+ years’ experience in relevant fields – mass production, optical alignment process development, and data processing & analysis.
• Participate in the process of bringing up a new technology from the R&D stage to high volume manufacturing.
• Hands-on debug experience with strong problem-solving ability.
• Proficient in SPC, 6 sigma, quality control process; good understanding of machine and process interactions.
• Excellent communication/presentation skills in English.
• We are seeking applicants who demonstrate the ability to work independently, deliver results promptly, communicate effectively, operate with a sense of urgency, and thrive in a fast-paced development and production environment.
• Ways to stand out in the crowd: Knowledge in Flip Chip Packaging / multi-chip module/ hybrid bonding / Optical Connector Assembly/ Optical Connector to chip attach.
• Hands-on experience working with machines and optimize process recipes.
• Knowledgeable in DFx, FMEA process, and failure analysis methodologies.
• Know-how of yield analysis and process cycle time reduction methodology.
• Experience working with OSAT in volume manufacturing environment as well as a background with the semiconductor or optical communication industry.
• Widely considered to be one of the technology world’s most desirable employers, NVIDIA is an industry leader with groundbreaking developments in High-Performance Computing, Artificial Intelligence, and Visualization.
• NVIDIA has some of the most forward-thinking and talented people in the world working for us.