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What You'll Do
- Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes. • Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects. • Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR). • Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions. • Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership. • Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield. • Influence supplier roadmaps; evaluate, qualify, and release next‑gen optical/e-beam inspection capabilities. • Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites. • Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain. • Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.
- Key Responsibilities • Serve as the technical lead for RDA methodologies and execution within NAND TD. • Perform root cause analysis using statistical, image-based, and data-driven techniques. • Develop, own, and communicate inspection and defect detection technology roadmaps. • Define program health metrics and drive continuous improvement initiatives (CIP). • Lead tool anomaly investigations, quarantine decisions, and corrective action planning. • Collaborate globally to align Best Known Methods (BKM) across sites.
- Stakeholder Collaboration • Technology Development (TD) Process and Integration teams • Yield Analysis and Data Science organizations • Global Manufacturing and Operations • Inspection/metrology equipment suppliers • Program and engineering leadership across regions Required Qualifications • Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years. • Minimum 3+ years hands-on RDA experience in semiconductor manufacturing or equipment engineering. • Demonstrated expertise in defect inspection, process monitoring, and yield learning.
- About Micron Technology, Inc.
- We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
- With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
- Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
- To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
- Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
- AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
- However, all information provided must be accurate and reflect the candidate's true skills and experiences.
- Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
- Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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/job/Fab-10NX-Singapore/Staff-Principal-Engineer--NAND-TD--RDA_JR99217
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