Staff Engineer, Package Development & Engineering

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What You'll Do

  • Technical Leadership & Program Execution Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
  • Define technical objectives, key deliverables, and resource allocation for pillar initiatives.
  • Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.
  • Governance & Operational Excellence Develop and enforce standardized methodologies for technical program management and pillar governance.
  • Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.
  • Ensure compliance with internal governance models and customer technical requirements.
  • Strategic Alignment & Technical Communication Align pillar objectives with PDE’s mission to embed analytics, simulation, and advanced modeling into development workflows.
  • Facilitate technical communication across BU, PDT, TPM, and central engineering teams.
  • Provide leadership updates on technical progress, risks, and mitigation strategies.
  • Performance & Continuous Improvement Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.
  • Conduct technical reviews to validate outcomes and capture lessons learned.
  • Mentor engineers and promote best practices for technical program management.
  • Qualifications Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline. 8+ years of experience in semiconductor packaging, process integration, or technology development.
  • Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
  • Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
  • Strong technical communication and leadership skills.
  • Preferred Skills Familiarity with Micron’s PDE, CPI, and NPI frameworks.
  • Expertise in simulation modeling, yield enhancement, and defectivity analysis.
  • About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
  • With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
  • Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
  • To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
  • Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
  • AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
  • However, all information provided must be accurate and reflect the candidate's true skills and experiences.
  • Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
  • Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Specialisation
Open roles at Micron Technology
2809 positions
Job ID
/job/MSB-Singapore/Lead-Engineer--Pillar-Lead----Package-Development---Engineering_JR88514

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