Sr. Assembly TD Engineer: Advance PKG stacking

About This Role

• A senior advanced assembly technology development engineer is responsible for introducing new technology to enable next generation packaging.
• This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone.
• This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully.
• Responsibilities Explore new technology on semiconductor industry such as flip chip, TCB and hybrid bonding process equipment and packaging material.
• Provide plan and resource requirement to enable new technology.
• Set up DOE plan and execute.
• Build sample and perform data analysis skill.
• Lead efficiency trouble shooting skill to improve process.
• Prepare documentation for process transfer from TD to HVM Review process stability by FDC, SPC and test result.
• Self-motivated and capable of working independently, proactively identifying opportunities and driving projects with minimal direction.
• Demonstrated ability to manage multiple technical challenges, prioritize tasks effectively, and deliver results in a fast-paced development environment.
• Applying AI, data analytics, and automation tools to accelerate process development, yield improvement, failure analysis, and technical decision-making.
• Requirement Hands-on experience in Flip chip, TCB or hybrid bonding process ( wet processing, surface cleaning, plasma surface activation/treatment, or plasma-based dry etching processes) development, process integration, or advanced packaging technologies is preferred.
• Strong technical problem-solving and data analysis skill.
• Open mindset to introduce new technology and process development.
• Above 3 years experience on Assembly process.
• Fluent in English communication.
• Excellent communication skill.
• Master degree in engineering as material science, mechanical, chemical engineering or physics and chemistry.
• About Micron Technology, Inc.
• We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
• With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
• Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
• To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com .
• Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
• Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
• AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
• However, all information provided must be accurate and reflect the candidate's true skills and experiences.
• Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
• Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.