Senior Design Engineer, HBM

Requirements

• Prior experience in HBM, DRAM, high ‑ speed I/O, or memory ‑ related designs Familiarity wiconstraints Apply AI/ML- nabled tools that enhance productivity, design quality, verification coverage, and time-to-market th 3D ‑ stacked architectures, TSVs, wide I/O interfaces, or PHY ‑ adjacent logic Understanding of DRAM array control and high speed circuit design Experience in function verification and timing analysis with mixed signal design.
• Familiar with device reliability.
• Experienced in reliability mitigation technology and verification flow.
• Familiar with analog/digital simulation tools, i.e., HSPICE, VerilogHDL , Primesim ’ MS in Computer Engineering or related field 3 years DRAM Design or Verification experience.
• Excellent Problem ‑ Solving & Analytical Skills idate memory, logic, analog, or mixed ‑ signal circuits used in HBM products, including PHY ‑ adjacent or subsystem logic Contribute to HBM architecture definition, block ‑ level specifications, and design tradeoff analysis across performance, power, area, and reliability Perform pre ‑ layout and post ‑ layout simulation, modeling, and analysis to ensure robust design margins Support tape ‑ out activities, ECOs, and reticle experiments as required Participate in functional, timing, and power verification using industry ‑ standard simulation tools Collaborate closely with Design Verification teams to review test plans, debug failures, and close coverage gaps (LLM) As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
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• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
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• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
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