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What You'll Do
- Advanced Package Development (Technology & Process Integration) Lead process integration for new package architectures , including materials, structure, and process flow definition Drive development builds (FUT/ES) , data analysis, and learning cycles to mature process capability Perform technical risk assessment (TRA), DOE planning, and failure mechanism analysis to identify and mitigate risks Define and optimize Critical-to-Quality (CTQ) parameters, process window, and yield performance Collaborate with Technology Development (TD) and design teams on design-for-manufacturability (DFM) and process feasibility Development activities align with the requirement to validate package functionality and ensure readiness before qualification and manufacturing handoff 2.
- NPI Execution & Qualification Readiness Own process integration deliverables across NPI phase gates Drive qualification builds (QS) and ensure readiness for Qualification Release (QR) Develop and execute qualification plans, reliability validation, and defect reduction strategies Lead FMEA (DFMEA/pFMEA) development, defect program management, and risk closure Ensure all phase gate deliverables and qualification criteria are met for product release The role directly supports structured NPI execution including phase gate reviews, qualification, and product launch readiness 3.
- Yield, Quality, and Manufacturing Readiness (HVM Enablement) Drive yield ramp, defect reduction, and process stability toward high-volume manufacturing Partner with Manufacturing (Ops), Quality, and Site teams to ensure process transfer and production readiness Lead issue resolution and root cause analysis for yield and reliability excursions Support safe launch readiness and quality compliance requirements 4.
- Cross-Functional Program Leadership Act as the PI owner interfacing across TD, PIE, NPI, QA, CEM, and Operations teams Drive alignment on program milestones, risks, and mitigation plans Provide technical leadership during phase gate reviews and executive updates Ensure effective communication across multi-site execution (e.g., development site → OSAT / manufacturing site) 5.
- Continuous Improvement & Process Maturity Improve process maturity (PMI progression) and enable scalable manufacturing capability Lead continuous improvement (CIP) activities for yield, cycle time, and cost optimization Capture learnings and feed back into design rules, process standards, and NPI methodology Required Qualifications Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Electrical, Mechanical, or related field) 5–10+ years experience in semiconductor advanced packaging / process integration Strong knowledge of: Advanced packaging (HBM, 3DS, flip chip, TSV, etc.) Process integration, yield analysis, and defect mechanisms Qualification, reliability, and NPI phase gate execution Experience in cross-functional program execution and multi-site collaboration About Micron Technology, Inc.
- We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
- With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
- Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
- To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com .
- Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
- Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
- AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
- However, all information provided must be accurate and reflect the candidate's true skills and experiences.
- Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
- Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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Open roles at Micron Technology
2992 positions
Job ID
/job/Taichung---Fab-16-Taiwan/Product-Integration-Engineer_JR103919
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