Principal Thin Films Engineer, Advanced Packaging

Requirements

• MS or PHD in Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields 7+ years of industry experience in Advanced Packaging with specialization in thin film deposition and characterization.
• Understanding of growth and characterization of thin films is required Proficiency with data analysis, DOE, and statistical techniques Knowledge of thermodynamics, chemical kinetics and their direct application to films deposition A history of using strong analytical and creative problem-solving skills paired with extensive technical knowledge to guide decisions and strategies for projects Preferred Qualifications: Experience with plasma processing and its impact on film properties are plus Experience in programming/scripting/automation and creation or regular use of AI agents As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
• Micron is proud to be an equal opportunity workplace and is an affirmative action employer.
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