Principal HIG ESD and Latch-up Engineer- HBM - TPG

Requirements

• Master’s degree or Ph.D. in Electrical Engineering or equivalent industry experience Strong fundamentals in ESD physics, latch up mechanisms, and advanced CMOS devices Hands-on experience with ESD protection circuits and latch up prevention techniques Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78 Preferred Qualifications: Experience supporting ESD and latch up sign-off for advanced DRAM or HBM products Knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies Experience working directly with foundry ESD and latch up teams Proven ability to mentor engineers and influence design methodology across teams About Micron Technology, Inc.
• We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
• With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
• Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
• To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com .
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