Principal Engineer, NAND Advanced Thin Films Process Development

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What You'll Do

  • Define and implement the technical strategy for structural and electrical film process development, ensuring alignment with both business and technology objectives .
  • Lead multi-functional teams in the development, integration, and scaling of thin film processes specifically tailored for advanced NAND structures and devices.
  • Oversee the end-to-end development of process modules, with a strong focus on manufacturability, scalability, and readiness for integration.
  • Resolve complex technical challenges that have significant business implications, including root cause analysis and mitigation of process/device failures.
  • Mentor senior engineers and influence the technical direction throughout the organization, fostering a culture of technical excellence and innovation.
  • Represent the function in technical forums and participate in strategic collaborations, including industry consortia, technical conferences, and joint development projects.
  • Deliver solutions that enable and maintain a competitive leadership position in advanced memory technology, including benchmarking against industry standards.
  • Drive technology transfer and ramp-up activities, ensuring seamless transition from R&D to high-volume manufacturing.
  • Identify and evaluate emerging trends, risks, and opportunities in structural and electric film technology, providing recommendations for future investments and critical initiatives.
  • Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and material utilization .
  • Technical Expertise Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications.
  • In-depth knowledge of process-device and mechanical interactions, challenges associated with technology/ device scaling, and the principles of reliability engineering for next-generation memory nodes.
  • Proven track record of developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems.
  • Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).
  • Strong foundation in t hin film process development using plasma and thermal methods , especially for dielectric (including lowK and highK films) , carbon-based fil ms , with an ability to analyze structural-process correlations and conduct failure analysis.
  • Experience in benchmarking technology, conducting competitive analyses, and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements.
  • Ability to lead cross-disciplinary teams in the development and deployment of new process technologies, including collaboration with integration, device, reliability, and manufacturing engineering groups.
  • Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.
  • Experience with regulatory compliance, intellectual property management, and technical documentation in a semiconductor manufacturing environment.
  • Qualifications PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field. 5-10 years of experience in Thin Film research and development for NAND process , specifically including CVD and Diffusion Thin Films.
  • About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
  • With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
  • Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
  • To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
  • Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
  • AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
  • However, all information provided must be accurate and reflect the candidate's true skills and experiences.
  • Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
  • Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Micron Technology

Fab 10N/X, Singapore

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2809 positions
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/job/Fab-10NX-Singapore/Principal-Engineer--NAND-Advanced-Thin-Films-Process-Development_JR88048

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