PR, Engineer, FE OCT CPEE ADT BOND

What You'll Do

• Process Development & Optimization Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration) Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets Drive process capability improvement (Cpk) and defect reduction Yield & Reliability Improvement Lead yield enhancement initiatives by analyzing process, tool, and material interactions Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions Equipment & Materials Engineering Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms) Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements Evaluate and introduce new materials/spares/parts for performance improvement Technology Transfer & Process Integration Support technology transfer and ramp-up across global sites Align process baseline (POR) and ensure consistency through documentation and control plans Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility Manufacturing Support & Problem Solving Diagnose and resolve manufacturing line issues impacting bonding yield and performance Analyze process excursions and implement containment and recovery actions Drive continuous improvement for cycle time, tool availability, and cost efficiency Qualification & Control Lead new process and baseline qualifications Develop control plans, SPC strategies, and inline monitoring systems Establish risk mitigation frameworks and ensure compliance with manufacturing standards Supplier & Cross-Functional Collaboration Partner with suppliers for technology development, process improvement, and cost optimization Audit material and equipment suppliers to ensure quality and reliability targets are met Collaborate with global teams and partners to drive alignment and execution Qualifications Technical Expertise Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred) Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred Skills & Competencies Proficiency in data analysis, SPC, and statistical modeling Strong problem-solving skills using structured methodologies (8D, FMEA, DOE) Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment Excellent communication and collaboration skills across global teams Education & Experience Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging About Micron Technology, Inc.
• We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
• With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
• Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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