Package Pathfinding Architect, MTS

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What You'll Do

  • Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
  • Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach Drive long‑term memory technology packaging strategy and influence industry standards Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products Serve as a technical interface to internal partners, customers, BUs, senior leaders.
  • AI Responsibilities: Develop AI based EDA and internal automation tool sets for enhancing design cycle efficiency.
  • Develop measurement automation for incoming substrate materials Candidate Profile or Job Requirements/Qualification/Selection Criteria: Details on what is required of the successful candidate.

Requirements

  • Master’s degree or equivalent degree and industry experience in EE, CE, CS, or related field At least 5 years of relevant industry experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design Deep understanding of memory timing, signaling, power, package process technology working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools Experience applying AI or LLMs for engineering efficiency Preferred Qualifications: PhD in a related technical field Recognized technical leadership across multiple products Experience in Signal and Power integrity analysis and mechanical and reliability analysis, thermal analysis Expertise in memory systems architecture Must Have Technical Skills, if any Strong understanding of memory timing and analysis Experience with Memory package and memory die level specs Familiarity with signal and power integrity concepts and tool.
  • Proficiency in data analysis tools such as JMP, Python, or MATLAB.
  • Must Have Soft Skills, if any Strong analytical and problem-solving skills with a data-driven mindset.
  • Effective communication skills for cross-functional collaboration with engineering, operations, and quality teams.
  • Detail-oriented with a commitment to quality and continuous improvement.
  • About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
  • With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
  • Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
  • To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
  • Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
  • AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
  • However, all information provided must be accurate and reflect the candidate's true skills and experiences.
  • Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
  • Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Micron Technology

MSB, Singapore

Specialisation
Open roles at Micron Technology
1540 positions
Job ID
/job/MSB-Singapore/Package-Pathfinding-Architect--MTS_JR106492

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