MTS Process Integration Engineer | APTD Die Level Technology

Requirements

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes Experience with HBM and logic integration, including thermal optimization Experience supporting cross-functional engineering programs in a fast-paced development environment Preferred Qualifications: Master’s degree or PhD in Materials Engineering, Chemical Engineering, or a related field Experience developing thermocompression bonding, microbump, or interposer-based packaging technologies Experience using data analytics, automation, or AI-enabled workflows to improve engineering efficiency Experience authoring technical papers, patents, or engineering documentation As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
• Micron is proud to be an equal opportunity workplace and is an affirmative action employer.
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