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What You'll Do
- New Product Qualification : Lead and coordinate package qualification efforts for new products and process introductions.
- Develop and implement robust qualification plans for new technologies and product developments.
- Provide recommendation on new product release readiness based on reliability assessment outcomes.
- Reliability Test Planning and Execution: Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues.
- Recommend effective screening methodologies for quality-sensitive lots.
- Maintain and improve monitoring systems to ensure ongoing package quality.
- Root Cause Analysis and Corrective Actions: Participate and drive in 8D problem-solving processes.
- Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs.
- Prepare and present technical reports for internal and external partners.
- Customer and Partner Engagement: Serve as a technical liaison for both internal teams and external customers regarding package-related to quality and reliability concerns.
- Evaluate customer requests for alignment with Micron’s quality policies.
- Provide technical expertise and support for customer inquiries and requirements.
- Qualifications and Skills: Good knowledge of semiconductor package assembly processes and surface mount technology.
- Good understanding of thermo-mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.
- Proficiency in industry-standard reliability test methods, life prediction acceleration models, and statistical sampling.
- Good analytical problem-solving abilities and project management skills.
- Good written and verbal communication skills in English and digital literacy are vital.
- Familiarity with backend manufacturing software systems.
- Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR).
- Self-motivated, meticulous, and capable of independent work and multi-cross functional team Education and Experience: Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field.
- Minimum 1- 2 years of experiences in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis About Micron Technology, Inc.
- We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
- With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
- Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
- To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
- Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
- AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
- However, all information provided must be accurate and reflect the candidate's true skills and experiences.
- Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
- Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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/job/MSB-Singapore/Engineer---Pkg-Reliability_JR102510
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