Advance Packaging Process Development Engineer

About This Role

• Micron’s Assembly Package Process Development team is looking for a motivated and experienced individual contributor for this position in Process Development team.
• A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron’s memory products ramp up including side by side certification with Manufacturing teams.
• Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate.
• Other deliverables in this job function are Assembly process guideline rules working closely with Design teams (Globally) and you will be involved in the running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).
• An importance of this role is process capability of innovative package technology: Deep fundamental understanding of the key risks in Bumping, TSV (Through-Silicon Via) packaging technologies.
• Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus.
• Finally, hands on integration experience in Package Assembly and Wafer Level package process are needed.
• JOB REQUIREMENT 0-2 years of experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes.
• Experience with High Bandwidth Memory (HBM) integration is a plus.
• Education: Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field.
• PhD / Masters Degree is preferred Technical Experience: Development experience in one or more areas of Photo, Physical Vapor Deposition (PVD),Chemical Vapor Deposition (CVD), Chemical Mechanical Planarization (CMP), wafer level molding, wafer level ball mount, Thermo-Compression Bonding (TCB), Flip Chip (FC), Underfill (UF), Hybrid bond, Glass carrier bond/ de-bond is a plus Problem-Solving Abilities: Strong analytical and problem-solving skills, with the ability to troubleshoot issues and optimize process parameters.
• Communication Skills: Effective verbal and written communication skills, with the ability to communicate clearly and professionally with team members and stakeholders Adaptability: Ability to work effectively in a fast-paced and dynamic environment, with the flexibility to work with global teams across different time zones Team Player: Collaborative mindset with a willingness to work closely with cross-functional teams to achieve common goals.
• Inclusion & Accessibility Statement Micron is committed to fair, inclusive, and merit‑based hiring.
• Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role.
• All qualified candidates are encouraged to apply.
• Values Alignment Successful candidates are expected to embody Micron’s core values: People – Respect, develop, and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Demonstrate accountability and perseverance Collaboration – Build trust and work as one team Customer Focus – Deliver excellence and value About Micron Technology, Inc.
• We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
• With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
• Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
• To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com .
• Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
• Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
• AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
• However, all information provided must be accurate and reflect the candidate's true skills and experiences.
• Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
• Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.