Sr. Staff Engineer, Package Engineering

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What You'll Do

  • Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product.
  • Working closely with cross functional teams – BU, CE, QA and Product engineering, d efine and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability.
  • Perform package design review.
  • Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.
  • Provide inputs to design guidelines and drive to implement the guidelines.
  • Achieve milestone dates for all NPI schedules.
  • Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.
  • Provide inputs to the package technology roadmap.
  • Support new package and technology development.
  • What We're Looking For Requirements: Bachelor’s degree in Mechanical Engineering and Material science or related fields and 5-7 years of professional experience in the semiconductor packaging field OR Master’s degree and/or PhD in ME and Material science or related fields and 3-5 years of professional experience in the semiconductor packaging field.
  • Experience in substrate, RDL and assembly.
  • Experienced with flip-chip package development and substrate review.
  • Basic Cadence APD and AutoCAD skills.
  • Understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.
  • The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.
  • Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers.
  • Good program management skills.
  • OSAT management experience is a plus.
  • Ability to work independently Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity.
  • We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us.
  • For additional information on what it’s like to work at Marvell, visit our Careers page.
  • Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
  • These tools must not be used to record, assist with, or enhance responses in any way.
  • Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time.
  • Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
  • This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR).
  • As such, applicants must be eligible to access export-controlled information as defined under applicable law.
  • Marvell may be required to obtain export licensing approval from the U.S.
  • Department of Commerce and/or the U.S.
  • Department of State.
  • Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment. #LI-SYU

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Marvell Technology

TW - Hsinchu - WXN

Specialisation
Open roles at Marvell Technology
503 positions
Job ID
/job/TW--Hsinchu---WXN/Sr-Staff-Engineer--Package-Engineering_2600417

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