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What You'll Do
- Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product.
- Working closely with cross functional teams – BU, CE, QA and Product engineering, d efine and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability.
- Perform package design review.
- Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.
- Provide inputs to design guidelines and drive to implement the guidelines.
- Achieve milestone dates for all NPI schedules.
- Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.
- Provide inputs to the package technology roadmap.
- Support new package and technology development.
- What We're Looking For Requirements: Bachelor’s degree in Mechanical Engineering and Material science or related fields and 5-7 years of professional experience in the semiconductor packaging field OR Master’s degree and/or PhD in ME and Material science or related fields and 3-5 years of professional experience in the semiconductor packaging field.
- Experience in substrate, RDL and assembly.
- Experienced with flip-chip package development and substrate review.
- Basic Cadence APD and AutoCAD skills.
- Understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.
- The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.
- Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers.
- Good program management skills.
- OSAT management experience is a plus.
- Ability to work independently Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity.
- We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us.
- For additional information on what it’s like to work at Marvell, visit our Careers page.
- Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
- These tools must not be used to record, assist with, or enhance responses in any way.
- Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time.
- Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
- This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR).
- As such, applicants must be eligible to access export-controlled information as defined under applicable law.
- Marvell may be required to obtain export licensing approval from the U.S.
- Department of Commerce and/or the U.S.
- Department of State.
- Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment. #LI-SYU
Sourced directly from Marvell Technology’s career page
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Specialisation
Open roles at Marvell Technology
503 positions
Job ID
/job/TW--Hsinchu---WXN/Sr-Staff-Engineer--Package-Engineering_2600417
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