Senior Staff Mechanical and Thermal Engineer

Overview

• About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world.
• Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
• At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow.
• For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
• Your Team, Your Impact As a Hardware Design Senior Staff Engineer with Marvell, you’ll be a member of the Multi Business Engieering group.
• You’ll be part of the evaluation board engineering team designing boards for many different groups at Marvell.
• Additionally, Marvell is designing more complex XPU and XPU attachment chips and boards than our competitors, for higher speeds than anyone else.
• We’re on the leading edge of this technology and you’ll love being a part of this.
• What You Can Expect Thermal Architecture: Lead the thermal definition and architectural design for next-generation high-speed networking and AI chips, ensuring optimal heat dissipation in constrained environments.
• Simulation & Validation: Perform comprehensive pre- and post-layout thermal and mechanical simulations to predict junction temperatures and structural risks.
• Testing & Characterization: Plan and execute hardware thermal characterization, using wind tunnels, thermal chambers, and IR sensors to validate simulation models against physical prototypes.
• Cross-Functional Collaboration: Partner with electrical (SI/PI), packaging, and PCB design teams to optimize component placement for both thermal efficiency and signal integrity.
• Vendor & Process Management: Manage the board-build and cooling-solution procurement process, working with vendors to ensure mechanical components meet Marvell’s rigorous quality and schedule requirements What We're Looking For Education & Experience: Bachelor’s degree in Mechanical Engineering or a related field with at least 9 years of professional experience; Master’s degree with 6+ years, etc.
• Thermal Management: At least 5 years of experience in thermal design for high-power semiconductors, including heat sink design, liquid cooling systems, and airflow optimization.
• Simulation Mastery: Expert-level proficiency in CFD (Computational Fluid Dynamics) and FEA (Finite Element Analysis) tools such as Ansys Icepak, FloTHERM, or Simcenter.
• Materials Science: Deep understanding of Thermal Interface Materials (TIMs), heat spreaders, and advanced packaging materials.
• Hardware Integration: Experience working with high-density system architectures, including rack-level cooling (air and liquid) for data center or networking environments.