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What You'll Do

  • As a Chip Lead, you will be responsible for driving a complete chip/chiplet program, taking technical ownership of the entire scope.
  • Your role will encompass contributing to architecture definition, design, verification, DFT, implementation & sign-off.

What You'll Do

  • Leading the program end-to-end from architecture to tapeout. - Work with systems teams to define architecture and design specifications. - Work with Design teams to define micro-architecture/ design implementation (module level & SOC level). - Ensure compliance to the company’s design process/ design flows.
  • Ensure design maturity at intermediate milestones, maintaining schedule cognizance, and adhering to defined quality metrics throughout the development process. - Overseeing the development of RTL code and ensuring its correctness. - Reviewing the verification process & verification scope/plan, including functional, coverage-driven, and power-aware verification. - Reviewing the Emulation plan/ scope to help define Tape-out gating items - Coordinating with DFT & Physical design teams to ensure successful implementation and tape-out. - Conducting reviews for performance tests to evaluate system stability, scalability, and reliability. - Addressing the complexity of multi-die solutions, including inter-die communication, power management, and thermal challenges. - Designing and implementing chips targeting datacenter applications, focusing on high performance, low power consumption, and scalability. - Collaborating with cross-functional teams across sites for smooth execution of the program, including post-Si debugs - Providing technical guidance and mentorship to junior engineers. - Ensuring compliance with industry standards and best practices What We're Looking For - Bachelor's or Master's degree in Electrical or Computer Science Engineering or a related field. - 16+ years of technical experience with 5+ tapeouts as a Chip lead. - Proven experience in leading RTL2GDSII programs. - Strong background in RTL design, verification methodologies, and physical design. - Proficiency in scripting languages (PERL/Python) and EDA tools. - Solid understanding of system and processor architecture, advanced memory, and IO technologies. - Experience with multi-die solutions and addressing their associated complexities. - Knowledge of designing chips for datacenter applications, including performance optimization and power management. - Excellent self-motivation, communication, problem-solving, and teamwork skills.
  • Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity.
  • We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us.
  • For additional information on what it’s like to work at Marvell, visit our Careers page.
  • Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
  • These tools must not be used to record, assist with, or enhance responses in any way.
  • Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time.
  • Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
  • This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR).
  • As such, applicants must be eligible to access export-controlled information as defined under applicable law.
  • Marvell may be required to obtain export licensing approval from the U.S.
  • Department of Commerce and/or the U.S.
  • Department of State.
  • Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment. #LI-CP1

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538 positions
Job ID
/job/Bangalore/Chip-Lead_2602678

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