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About This Role
- Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development.
- Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies.
- By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation.
- Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.
- Key Responsibilities - Drive technology development and enablement for both high-volume manufacturing and future technologies. - Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design. - Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods. - Develop and implement technology roadmaps to guide future manufacturing needs and industry standards. - Collaborate with equipment and material suppliers to design and implement enabling process technologies. - Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output. - Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement. - Optimize production efficiency, manufacturing techniques, and output for existing and new products. - Partner with cross-functional teams to ensure process integration and alignment with project deliverables.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience. - OR Master's degree in the same fields with 4+ years of experience. - OR PhD in the same fields with 2+ years of experience.
- Experience listed above should be a combination of the following: - Development methodologies, statistical process control, and/or data analytics. - Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
- This position is not eligible for Intel Immigration Sponsorship Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging. - Demonstrated expertise in leading programs from early strategy formation through high-volume production. - Recognized technical leadership with a proven track record of solving complex engineering challenges. - Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections. - Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.
- Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale.
- Apply now to bring your expertise and passion to our team.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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643 positions
Job ID
/job/US-Oregon-Hillsboro/WATD-Module-Development-Engineer_JR0285223
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