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About This Role
- The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies.
- In this position, you will drive quality and reliability standards for cutting-edge packaging components, ensuring they meet the stringent requirements of our products and production environments.
- This dynamic role bridges technology development and manufacturing, empowering you to make impactful contributions to Intel's product development milestones and long-term customer satisfaction.
- You will collaborate with diverse cross-functional teams, influence key decision-making processes, and innovate reliability models to shape the future of Intel's packaging technologies.
- Key Responsibilities - Develop and maintain quality and reliability standards for packaging components, including defining inspection and testing mechanisms, conducting quality assessments, and performing statistical analyses. - Evaluate materials, processes, and techniques used in production to ensure compliance with product and system-level requirements. - Define metrology strategies to ensure comprehensive quality parameters are captured across modules for packaging. - Develop and sustain equipment to evaluate silicon and packaging technologies under simulated field conditions, such as heat, humidity, and temperature variations. - Analyze quality and wearout reliability data to identify potential risk areas and provide actionable insights for process improvement. - Develop reliability models by performing statistical analysis to categorize failure impacts and assess risks in meeting customer specifications. - Innovate new acceleration techniques, analytical tools, and quality screens to ensure early identification of potential issues with new packaging processes. - Drive standardization in product qualification, manufacturing quality systems, and methods, enabling continuous improvement in quality and reliability practices. - Collaborate with internal teams and external partners to ensure packaging process maturity, reduce risks, and meet product milestones. - Respond to quality excursions, troubleshoot issues, and provide recommendations to improve product reliability and specifications.
Requirements
- PhD degree in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field with at least 6 months of experience in semiconductor packaging, assembly processes, and understanding of failure modes and mechanisms.
- Preferred Qualifications - Proficiency in statistical process control, reliability modeling, and statistical data analysis. - Knowledge of design of experiments (DOE) principles and data analytics tools. - Experience with package technologies such as Ball Grid Array (BGA) or wafer-level manufacturing. - Familiarity with advanced analytical lab techniques like acoustic imaging, SEM, EDX, FTIR, or mechanical testing. - Programming or scripting experience for data analysis using Python, SQL, or similar tools. - Proven ability to lead and influence cross-functional teams to achieve strategic goals. - Strong problem-solving skills and experience with methodologies like 8D and 5 Whys.
- Join Intel's innovative engineering community and help us create technologies that will shape the future.
- Together, we can achieve extraordinary results.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $120,860.00-170,630.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
Open roles at Intel
643 positions
Job ID
/job/US-Arizona-Phoenix/Thermal-Quality-and-Reliability-Engineer_JR0285220
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