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About This Role
- The Role and Impact: Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
- In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages.
- With an emphasis on experimentation, data analysis, and collaboration, you'll support Intel's mission to deliver world-class products that empower global innovation.
- This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry.
- Key Responsibilities: Develop and optimize assembly processes and equipment to enable Intel's next-generation packaging technologies.
- Apply statistical methods and principles of design of experiments (DOE) to establish and improve process specifications.
- Analyze process data to identify opportunities for improving quality, yield, productivity, and cost efficiency.
- Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs.
- Document technical advancements and improvements through white papers and reports.
Requirements
- Possess a Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field.
- Familiarity with semiconductor assembly equipment and processes.
Nice to Have
- PhD degree holders, or Master’s degree holders with less than 2 years of experience in Thermal Compression Bonding process, with First Class Honours required.
- Experience with data science tools such as Python, SQL, or JMP.
- Proficiency in statistical methods, including statistical process control (SPC) and data analytics.
- Fundamental understanding of semiconductor devices and packaging technology.
- Mechanical design experience, including CAD tools.
- Strong written and verbal communication skills, with the ability to influence and collaborate across teams.
- A proactive approach to challenges and the ability to thrive under tight timelines and schedules.
- Has direct relevant experience (internship/research project/etc.) to Thermal Compression Bonding process Job Type: College Grad Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
- We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
- Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Sourced directly from Intel’s career page
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767 positions
Job ID
/job/Malaysia-Kulim/Thermal-Compression-Bonding-Development-Engineer_JR0284088
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