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About This Role
- As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals.
- Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency.
- Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes.
- Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes.
- This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry.
- By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions.
- Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
- Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC).
- Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces.
- Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods.
- Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones.
- Document technical improvements and innovations through research papers and presentations.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- This position is not eligible for Intel immigration sponsorship Knowledge and/or experience listed below would be obtained through a combination of your school/work and/or classes and/or research and/or relevant previous job and/or internship experiences.
- Minimum Qualifications Bachelor's degree in mechanical engineering or a related field with 6 months of hands-on experience.
- Experience mentioned above should be in: Equipment Engineering, Mechanical Desing and/ or Process Engineering.
- Preferred Qualifications Experience with mechanical design software such as SolidWorks or AutoCAD.
- Portfolio showcasing self-completed projects from concept to fabrication.
- Familiarity with semiconductor packaging processes and technology.
- Strong technical and analytical skills, with a proven ability to deliver results on complex, time-critical projects.
- Join us to contribute to groundbreaking technology innovation while growing your career in a dynamic and inclusive environment.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $85,200.00-120,280.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
602 positions
Job ID
/job/US-Arizona-Phoenix/TD-Media-and-Collaterals-Development-Engineer_JR0287421
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