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About This Role
- Note: This role requires regular onsite presence to fulfill essential job responsibilities.
- Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
- Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
- Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
- Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
- Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral quality and reliability.
- Performs and influences media and collateral design, material selection and prototype development to meet assembly module needs, based on fundamental understanding of failure mechanisms.
- Provides consultation concerning design problems and improvements in the assembly packaging process, and responds to customer/client requests or events as they occur.
- Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones Qualifications: Minimum qualifications are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Possess a BS/MS/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field. •Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Nice to Have
- Strong mechanical design software experience (SolidWorks, AutoCAD, etc) • Portfolio of self-completed project examples from concept to fabrication • Assembly equipment, process, media, and/or collateral experience • Technical innovation and deliver results for complex, time critical technical projects. • Understanding of semiconductor fabrication processes and technology with technical and analytical skills.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
765 positions
Job ID
/job/US-Arizona-Phoenix/TD-Media-and-Collaterals-Development-Engineer_JR0279514
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