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About This Role
- Intel's APTM organization is seeking a highly driven Staff Technology Development Substrate Yield Lead to drive supplier yield, defect reduction, technical issue closure, and process-control maturity supporting next-generation EMIB-T substrates across Japan suppliers.
- The team will be chartered to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration partnering with substrate suppliers locally at the HVM factories.
- This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG).
- The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision.
- Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones.
- This position requires an Expat assignment in Japan.
- Key responsibilities Own day-to-day yield performance and issue closure for assigned supplier lines, modules, products, or process areas.
- Lead structured investigations from containment and hypothesis development through experiments, failure analysis, corrective action, and sustainment.
- Use statistical and spatial analytics to identify signatures by line, tool, material, panel position, geometry, product, and time.
- Establish clear supplier actions, owners, completion criteria, control limits, and verification plans.
- Support DFM/DFY, qualification, ramp readiness, change control, and deployment of dashboards or automated analytics.
- Capture reusable learning and communicate facts, hypotheses, decisions, and residual risks clearly.
- Behavioral traits Strong analytical and problem-solving skills with the ability to make data-driven decisions in complex environments.
- Experience working across multiple organizations and influencing stakeholders to achieve results.
- Demonstrated ability to independently manage complex technical issues, execute with urgency, and drive actions to closure.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
- This position is not eligible for Intel immigration sponsorship Minimum Qualifications Bachelor's degree with +8 years of experience in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline, OR Master's degree with 6+years, OR PhD with 4+years. 5+ years of experience in: Semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
- Hands-on experience in substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
- Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.
Nice to Have
- Experience working directly with substrate suppliers and external manufacturing partners.
- Demonstrated program leadership experience, including coordinating cross-functional technical teams and driving execution in high-visibility, high-impact environments.
- Experience with semi-additive processing, build-up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration.
- Prior experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.
- Experience with automated data pipelines, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
666 positions
Job ID
/job/US-Arizona-Phoenix/Staff-EMIB-T-Substrate-Yield-Engineer_JR0287730-1
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