Staff EMIB-T Substrate Yield Engineer

About This Role

• Intel's APTM organization is seeking a highly driven Staff Technology Development Substrate Yield Lead to drive supplier yield, defect reduction, technical issue closure, and process-control maturity supporting next-generation EMIB-T substrates across Japan suppliers.
• The team will be chartered to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration partnering with substrate suppliers locally at the HVM factories.
• This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG) .
• The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision.
• Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones.
• This position requires an Expat assignment in Japan.
• Key responsibilities Own day-to-day yield performance and issue closure for assigned supplier lines, modules, products, or process areas.
• Lead structured investigations from containment and hypothesis development through experiments, failure analysis, corrective action, and sustainment.
• Use statistical and spatial analytics to identify signatures by line, tool, material, panel position, geometry, product, and time.
• Establish clear supplier actions, owners, completion criteria, control limits, and verification plans.
• Support DFM/DFY, qualification, ramp readiness, change control, and deployment of dashboards or automated analytics.
• Capture reusable learning and communicate facts, hypotheses, decisions, and residual risks clearly.