Silicon Packaging Design Engineer

About This Role

• As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation.
• You will be responsible for the end-to-end development of substrate designs, from concept through tape-out, ensuring optimal performance, cost efficiency, and manufacturability.
• This position provides an exciting opportunity to work collaboratively with silicon and hardware teams, directly impacting Intel's success in delivering world-class solutions for high-performance applications.
• Key Responsibilities Drive the physical layout and routing of package designs, ensuring alignment with silicon, package, and board performance requirements.
• Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs.
• Define and implement substrate design rules, conducting internal and external reviews to ensure designs meet quality standards.
• Analyze data, resolve Design Rule Checks (DRCs), and optimize package designs for manufacturability and performance.
• Collaborate with cross-functional teams to optimize pinout and silicon-package-board interactions.
• Complete documentation and collateral into the product lifecycle management system of record Behavioral traits Problem-solving skills and a proactive approach to challenges.
• Excellent communication and interpersonal skills for effective cross-functional collaboration.
• Manage multiple tasks and projects simultaneously under tight deadlines.