Silicon Packaging Design Engineer

About This Role

• Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity.
• As a key contributor to Intel's cutting-edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions that meet performance, cost, and manufacturability goals.
• Your expertise will directly contribute to Intel's mission to create world-changing technology that improves lives and connects communities worldwide.
• Key Responsibilities: - Design and implement physical layout and routing of silicon interposers and embedded bridges. - Perform substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and manufacturability. - Collaborate closely with silicon, technology development and hardware teams to optimize system-level design, including silicon-package-board integration and pinout. - Propose design updates changes for rules and conduct internal and external reviews to ensure design feasibility. - Analyze design data and resolve design rule checks (DRCs) to achieve optimized and manufacturable package designs. - Utilize industry-leading electronic design automation (EDA) tools, including Virtuoso, Innovus, FusionCompiler, ICvalidator, and Calibre, to create robust package layouts. - Document processes and design specifications in the product lifecycle management system to ensure traceability and efficient collaboration. - Conduct reviews with partner teams to close milestone requirements Qualifications: Minimum qualifications are required to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.