Signal Integrity Student Worker Engineer

About This Role

• As a Physical Design Engineering Undergraduate Intern, you will contribute to the physical implementation of platform designs to ensure readiness for manufacturing.
• For this role the candidate would support Signal Integrity engineers in electrical design and validation activities for Client, Edge and Physical AI platforms, you will be working on design, deploy, and optimize high-speed interconnect architecture.
• This role offers hands-on experience in physical design flows, enabling you to build skills, apply knowledge, and explore future career opportunities.
• The Silicon and Platform Engineering Group (SPE) drives innovation and ensures the physical designs of silicon and platforms meet manufacturing and performance standards.
• The team focuses on delivering scalable, efficient solutions that support Intel's broader goals of advancing technology and enabling cutting-edge products.
• Joining this group means becoming part of a collaborative environment dedicated to excellence in engineering and design.
• The primary responsibilities for this role will include, but are not limited to: Assist in the physical implementation of package and platform designs, contributing to the Signal Integrity of the High Speed Interconnects.
• Collaborate with cross-functional teams to support design scalability, automation, and manufacturability.
• Engage in verification and signoff activities to ensure compliance with performance and manufacturing standards.
• Apply theoretical knowledge to practical projects, gaining exposure to physical design optimization, signal integrity analysis, and noise glitch evaluation.
• Support design initiatives aligned with Intel's business goals, leveraging advanced tools and methodologies.