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About This Role
- Join Intel's Innovation Journey Are you passionate about driving breakthrough technologies that power the world's most advanced computing solutions? Intel Foundry Group is seeking a talented Senior Yield Engineer – Substrate & Advanced Packaging to join our Advanced Packaging Technology and Manufacturing team.
- In this role, you'll be at the forefront of semiconductor innovation, working with cutting-edge technology nodes and making direct impact on next-generation products that shape the future of computing.
- What You'll Do Drive Technology Excellence Through Data-Driven Insights Lead process development initiatives throughout complete technology node lifecycles by identifying and resolving critical yield limiters Perform advanced statistical analysis and create compelling data visualizations to build accurate process development roadmaps that achieve key technology yield milestones Develop innovative methods, processes, and systems to consolidate and analyze diverse big data sources, establishing optimal methodologies for defect mode understanding and yield modeling Transform Complex Data into Actionable Solutions Organize, interpret, and structure insights from fabrication process, defect, and electrical data while detecting anomalies and driving process improvements for yield enhancement Extract meaningful insights from both structured and unstructured data by synthesizing large data volumes using statistics, machine learning, and advanced coding techniques Develop sophisticated systems that transform complex experimental and manufacturing data into concrete yield improvement actions Collaborate Across Teams for Maximum Impact Execute new product introductions and enable design technology co-optimization through participation in factory task force design of experiments Create cross-functional partnerships across organizations to debug yield limiters in design, test, and process development areas Ensure manufacturability through comprehensive analysis of process and specification corners, working closely with design teams to resolve yield issues before manufacturing ramp Innovate with Advanced Tools and Methodologies Develop cutting-edge tools, multivariate algorithms, and methodologies for high-volume data analysis to identify root cause yield limiters Perform fault isolation and failure analysis using various advanced techniques including ATE testing, DFx software tools, optical probing, logic/circuit simulation, and emulation Develop measurement recipes that provide rapid, accurate feedback on product integrity to resolve yield and quality issues Behavioral traits that we are looking for: Strong analytical and problem‑solving skills Communicates clearly and effectively with cross‑functional teams, customers, and external partners Works effectively in ambiguous problem spaces and balances technical tradeoffs using sound engineering judgment Demonstrates ownership and accountability for technical outcomes and deliverables Collaborates productively across organizational boundaries and multi‑site teams Maintains a strong focus on design quality, documentation, and technical rigor Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
- See Intel Benefits for more details.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
- Immigration Sponsorship Information Minimum Qualifications and Experience : Candidate must possess a Masters degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry/Physics or related field and 5+ years of experience.
- Or a PhD degree in the same fields and 3+ years of experience. 3+ years of experience using engineering analysis tools, data analysis techniques, and scripting languages (e.g., Python) to automate analytical workflows and standard analysis tasks. 3+ years of experience working with logic or substrate manufacturing process flows, including direct involvement in yield analysis or process optimization activities. 3+ years of experience performing commonality analysis and large‑scale data analytics using JMP, SQL, and Python, including experience developing dashboards or data visualizations to enable broad access to datasets.
- Preferred Qualifications and Experience : Experience in integration, yield, LYA, FA, test, sort, defect metrology, or QNR.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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765 positions
Job ID
/job/US-Arizona-Phoenix/Senior-Yield-Engineer---Substrate---Advanced-Packaging_JR0283439
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