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About This Role
- The Role and Impact As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
- You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
- Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
- Key Responsibilities Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.
- Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
- Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
- Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
- Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
- Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
- Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
- Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
- Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
- Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.
- Behavioral Skills Demonstrated ability to solve complex technical problems using structured engineering methodologies.
- Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
- Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
- Proven ability to mentor and develop engineers and technical team members.
- Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.
Requirements
- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of experience; OR Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of experience; OR PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 4+ years of experience. 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.
- Preferred Qualifications Experience leading first-of-a-kind (FOK) process or equipment development programs.
- Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
- Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
- Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
- Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
- Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
- Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
- Experience supporting technology transfer from development to manufacturing.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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695 positions
Job ID
/job/US-Oregon-Hillsboro/Senior-Technologist--Hybrid-Bonding-Module_JR0284467
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