Senior Substrate Engineer

About This Role

• The Role and Impact As a Process Integration Development Engineer, you will play a pivotal role in driving revolutionary advancements in substrate manufacturing technologies.
• You will oversee the development, optimization, and integration of cutting-edge processes to improve performance, yield, and reliability of substrates used in semiconductor packaging.
• Through hands-on collaboration with cross-functional teams, your work will directly contribute to Intel's leadership in innovative packaging solutions and manufacturing excellence.
• Business group Asia Capex Substrate Integration is part of Intel Corporation's broader effort to deliver world-class substrate packaging solutions, enabling the development of advanced semiconductor technologies.
• The group focuses on integrating high-performance substrate processes, driving innovation in manufacturing and packaging, and supporting Intel's mission of creating technology that powers global progress.
• Key Responsibilities Develop and optimize process integration methodologies for advanced substrates, ensuring high yield and product reliability.
• Collaborate with cross-functional teams including design, manufacturing, and quality groups to identify and address technical challenges.
• Evaluate and implement new materials, tools, and techniques to improve substrate performance and cost efficiency.
• Conduct detailed analysis to troubleshoot process issues and drive continuous improvement initiatives.
• Support technology transfer and ramp-up for high-volume manufacturing operations.
• Document process development efforts and results, creating clear guidelines for production teams.
• Expectation is for candidate to be at supplier factory on-site for minimum of 4 days a week Qualifications: Minimum Qualifications Bachelor's degree in a relevant field such as Materials Science, Chemical Engineering, Mechanical Engineering, or a closely related discipline. 3+ years of hands-on experience in process integration or substrate development within semiconductor manufacturing.
• Proficiency in process characterization techniques and tools, including SEM, AFM, X-ray, or similar methodologies.
• Demonstrated ability to analyze process data and implement data-driven improvements.
• Strong knowledge of substrate and packaging technologies in semiconductor applications.
• Preferred Qualifications Master's or Ph.D. degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field with 4+ years experience.
• Proven track record of developing innovative solutions to complex technical challenges.
• Strong communication and collaboration skills to work effectively in cross-functional teams.
• Familiarity with high-volume manufacturing environments and technology transfer processes.
• Experience with statistical process control (SPC), design of experiments (DOE), and other quality improvement methods.
• Your expertise and dedication could drive transformative innovation at Intel, applying your skills to shape the future of semiconductor technology.
• Take the next step in your career and join us in making a measurable impact.