Senior CAD Engineer – Physical Design Signoff

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About This Role

  • We are looking for a highly motivated Senior Physical Design Signoff Automation Engineer to develop and deploy signoff methodologies and automation solutions for advanced CPU and SoC designs.
  • The candidate will work closely with Physical Design, Timing, Power, Reliability, and CAD teams to improve signoff quality, productivity, and turnaround time.
  • The ideal candidate possesses deep expertise in Parasitic Extraction, Static Timing Analysis (STA), Electrical Rule Checking (ERC), and Power Integrity signoff, along with strong programming and automation skills.
  • Key Responsibilities Develop and enhance automation solutions for Physical Design signoff flows, including: RC Extraction Static Timing Analysis (STA) Electrical Rule Checking (ERC) Power Integrity (IR Drop/EM) Signal Integrity (SI) Create scalable automation frameworks to reduce signoff turnaround time and improve engineering productivity.
  • Develop scripts and tools to automate signoff checks, debugging, reporting, and data analysis.
  • Analyze and resolve timing, extraction, ERC, and power signoff issues in collaboration with design teams.
  • Drive methodology improvements to improve signoff convergence, quality, and correlation across implementation stages.
  • Partner with EDA vendors and internal CAD teams to evaluate and deploy new signoff capabilities.
  • Build dashboards and reporting infrastructure to monitor signoff health and project readiness.

Requirements

  • M.Tech/M.S. in Electrical Engineering, VLSI, Computer Engineering, or related field. 8+ years of industry experience in Physical Design, Signoff, CAD, or Design Automation.
  • Strong proficiency in: Python Tcl Shell scripting Preferred Qualifications Experience working on advanced process technologies (3nm, 2nm, Intel 18A/14A, or equivalent).
  • Understanding of AOCV/POCV and variation-aware timing methodologies.
  • Familiarity with power delivery networks, EM analysis, and reliability signoff.
  • Experience in Machine-learning methods and Agentic AI systems to solve CAD problems Exposure to CPU core, high-performance compute, or large SoC designs.
  • Experience with distributed computing environments and large-scale signoff infrastructure.

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Intel

India, Bangalore

Specialisation
Salary range
₹5-11 LPA to ₹38-65 LPA
Open roles at Intel
732 positions
Job ID
/job/India-Bangalore/Senior-CAD-Engineer---Physical-Design-Signoff_JR0288131

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