Quality and Reliability Engineer

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About This Role

  • The Role and Impact: We are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs.
  • The scope will be supporting C4 bumping and interconnect quality for WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly).
  • You will play a critical role in ensuring our products and bumping processes meet the highest quality and reliability standards from wafer fabrication through packaging and assembly.
  • This position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction.
  • By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader.
  • This role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices.
  • Key Responsibilities: Manage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive containment strategies, rapid product risk assessments and discrepant material dispositions (3D).
  • Effectively communicate with internal Foundry partners and Intel customers.
  • Provide technical input on solder joint reliability and thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.
  • Collaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's).
  • Develop and implement systems for early detection and containment of excursions.
  • Own and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods.
  • Support factory Operations and output commits, e.g. daily/ timely material disposition and die inking for meeting commits.
  • Support technology certification and ramp activities collaborating with TD and ramp partners.
  • Use data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data.
  • Extract insights from structured and unstructured data using statistics and machine learning to determine product disposition.

Requirements

  • Master's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with relevant work experience in semiconductor Manufacturing, C4 bumping process and chip assembly. 5 years of relevant work experience in semiconductor Manufacturing, C4 bumping process, and chip assembly with a bachelor's degree.
  • Experience in solder joint reliability, excursion management, and failure mode analysis.
  • Proficiency in statistics and data analytics tools for quality and reliability assessments.
  • Experience with data mining to synthesize insights from structured and unstructured data.
  • Familiar with QnR Quality Systems and tools.
  • Effective verbal and written communication, and effective meetings skills.
  • Motivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes.
  • Demonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st.
  • Be comfortable working in a diverse environment and across geographies.

Nice to Have

  • Influencing skills to drive a quality-focused mindset across the organization.
  • Proven ability to manage impactful Material Review Boards (MRBs).
  • Join us to shape the future of manufacturing quality and reliability at Intel and make a lasting impact on our products, processes, and customer experiences.
  • Apply now to be part of this exciting journey.

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Intel

Malaysia, Penang

Specialisation
Open roles at Intel
590 positions
Job ID
/job/Malaysia-Penang/Quality-and-Reliability-Engineer_JR0286989

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