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About This Role
- The Role and Impact: We are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs.
- The scope will be supporting C4 bumping and interconnect quality for WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly).
- You will play a critical role in ensuring our products and bumping processes meet the highest quality and reliability standards from wafer fabrication through packaging and assembly.
- This position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction.
- By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader.
- This role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices.
- Key Responsibilities: Manage manufacturing excursions while driving continuous improvement: chair MRB meetings, drive containment strategies, rapid product risk assessments and discrepant material dispositions (3D).
- Effectively communicate with internal Foundry partners and Intel customers.
- Provide technical input on solder joint reliability and thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.
- Collaborate with cross-functional teams to drive effective Root Cause and systemic Corrective actions (8D's).
- Develop and implement systems for early detection and containment of excursions.
- Own and continuously enhance material disposition RFC's, eDispo screens, and other QnR best known methods.
- Support factory Operations and output commits, e.g. daily/ timely material disposition and die inking for meeting commits.
- Support technology certification and ramp activities collaborating with TD and ramp partners.
- Use data extraction tools, custom scripting and statistical analysis techniques to assess and present inline, EOL, and Reliability data.
- Extract insights from structured and unstructured data using statistics and machine learning to determine product disposition.
Requirements
- Master's degree in Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with relevant work experience in semiconductor Manufacturing, C4 bumping process and chip assembly. 5 years of relevant work experience in semiconductor Manufacturing, C4 bumping process, and chip assembly with a bachelor's degree.
- Experience in solder joint reliability, excursion management, and failure mode analysis.
- Proficiency in statistics and data analytics tools for quality and reliability assessments.
- Experience with data mining to synthesize insights from structured and unstructured data.
- Familiar with QnR Quality Systems and tools.
- Effective verbal and written communication, and effective meetings skills.
- Motivated self-starter and self-driven learner to develop skills in various semiconductor and chip assembly processes.
- Demonstrate strong Quality and Zero-defect mindset, and Intel values of Velocity, Efficiency, and Customer 1st.
- Be comfortable working in a diverse environment and across geographies.
Nice to Have
- Influencing skills to drive a quality-focused mindset across the organization.
- Proven ability to manage impactful Material Review Boards (MRBs).
- Join us to shape the future of manufacturing quality and reliability at Intel and make a lasting impact on our products, processes, and customer experiences.
- Apply now to be part of this exciting journey.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
590 positions
Job ID
/job/Malaysia-Penang/Quality-and-Reliability-Engineer_JR0286989
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