Quality and Reliability Engineer (Advance Packaging & Assembly)

About This Role

• The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros).
• This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology.
• You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly.
• The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement.
• You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers.
• Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications.
• Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies.
• Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality.
• Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps.
• Support manufacturing excursion management, including MRB facilitation, containment strategies, rapid product risk assessment, discrepant material disposition decisions, and clear communication with Foundry partners and Intel customers.
• Provide technical input on thermomechanical interactions between wafer, die, and package to support risk assessment and technical decision-making.
• Own and continuously improve material disposition RFCs, Rel monitors (QTM, ORM), and Quality and Reliability best known methods.
• Support technology certification and transfer activities in collaboration with technology development and ramp partners.
• Use data extraction and statistical analysis tools, and custom scripting to flag product, process, or customer risks.
• Represent the Quality and Reliability function as the voice of the customer in internal forums, providing recommendations to improve system, process, product quality, and reliability outcomes.