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About This Role
- At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet.
- The Foundry labs directly support advancement of Intel's technology development.
- The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding.
- Our job is to understand where our manufacturing process and metrologies need to be improved.
- We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand.
- The position will involve daily focus ion beam(FIB) lamella preparation and advanced transmission electron microscopy (TEM) characterization on semiconduction nanostructures using TEM imaging, electron diffraction, strain analysis, EDS and EELS.
- The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies.
- We are embarking on those changes.
- The Engineer will be responsible for but not limited to: o Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. o Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. o Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. o Contributes to continuous improvement efforts in high volume manufacturing environments. o Performs other related duties as required or as directed. o Continuous upgrading of skill set; requires an open attitude and skills to learn from Qualifications: Minimum Qualifications: o Associate degree with 8 years of work experience, Bachelor degree with 4 years of work experience or Master degree with 2 years of work experience.
- The work experience must be hands-on FIB sample preparation / Transmission Electron Microscopy (TEM) prep operation in industry. o Strong track record of experience, innovation and ownership in FIB and TEM area.
Nice to Have
- o Strong communication skills to work effectively with peer and customers.
- Be able to work both independently and in teams. o Working knowledge and experience of semiconductor process integration.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
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607 positions
Job ID
/job/US-Oregon-Hillsboro/Process-Integration-Development-Engineer_JR0287348
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