Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
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About This Role
- This role requires regular onsite presence to fulfill essential job responsibilities.
- Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.
- Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line.
- Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals.
- Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.
- Owns execution of maintenance and repair activities for equipment and relevant module of components.
- Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required.
- Owns process development line items aligned to high volume process nodes.
- Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites.
- Owns development and optimization of excursion prevention systems for the equipment and process.
- Owns detection of discrepant material or activities of the equipment and process.
- During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).
Requirements
- Bachelor's degree in Materials/Mechanical/Chemical/Electrical Engineering or related field.
- At least 2 years hands-on experience in die attach/TCB, flipchip, or semiconductor assembly process.
- Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and finepitch alignment.
- Proficiency in SPC and datadriven problem solving.
- Experience with metrology analytics. ex: Xray, warpage measurement, optical inspection (AOI), microscopy.
- We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
- Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Sourced directly from Intel’s career page
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Specialisation
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784 positions
Job ID
/job/Malaysia-Kulim/Process-and-Equipment-Module-Engineer--DIE-Attach-or-Thermal-Compress-Bonding-_JR0279601
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