Packaging Technology Development Graduate Intern

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About This Role

  • Intel is seeking a motivated Module Engineering Intern to join our dynamic semiconductor manufacturing team.
  • In this role, you will support the development and implementation of manufacturing processes for specialized modules, contributing directly to Intel's production of world-class semiconductor products.
  • Through hands-on experience with cutting-edge equipment and process optimization, you will collaborate with engineering teams to address challenges, explore innovative solutions, and play a key role in shaping the future of technology.
  • Business group As part of Intel Foundry, you will join a team dedicated to advancing semiconductor technology and manufacturing excellence.
  • Our group focuses on optimizing processes and equipment for high-quality production, supporting Intel's broader goals of delivering innovative solutions for global technology challenges.
  • Key Responsibilities - Assist in the development and optimization of manufacturing processes for specific modules used in semiconductor production. - Support equipment troubleshooting, maintenance, and qualification activities to ensure operational excellence. - Collaborate with engineering teams to sustain and improve manufacturing processes and equipment. - Apply process characterization methodologies and Design of Experiments (DOE) principles to enhance quality and production efficiency. - Conduct structured data analysis and experiments to identify areas for process improvement. - Participate in hands-on engineering projects and activities in a cleanroom environment.

Requirements

  • to be initially considered for this position.
  • Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
  • Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
  • Minimum Qualifications - Perusing a PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Polymer Engineering, or a related field . 3+ months of experience listed above should be in one or more of the following: - Experience with semiconductor manufacturing equipment and process development methodologies. - Experience in data analysis tools such as MATLAB, Python, or JMP.
  • Preferred Qualifications - GPA 3.0 - Hands-on experience with process optimization, troubleshooting engineering tools, and cleanroom environments. - Familiarity with DOE principles, structured problem-solving techniques, and statistical data analysis. - Experience in failure analysis, yield analysis, and process improvement strategies.
  • We invite you to bring your enthusiasm, technical expertise, and fresh perspective to Intel and embark on an exciting internship opportunity.
  • Join us in shaping the future of technology-apply today.

Benefits

  • We offer a total compensation package that ranks among the best in the industry.
  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel .
  • Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Our standard internship rates are based on your degree, location, and the job role.
  • Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

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Intel

US, Arizona, Phoenix

Specialisation
Open roles at Intel
612 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Technology-Development-Graduate-Intern_JR0287080

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