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About This Role
- The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
- Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
- As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. • Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities • Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. • Manage projects to ensure alignment with product development schedules and execution milestones. • Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. • Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments • Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate should demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills.
- This position requires regular onsite presence.
Nice to Have
- are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. • Experience listed above should be a combination of the following: Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Nice to Have
- One or more years of experience in one or more of the following areas: • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) • Delivery of results for complex, time-critical technical projects. • Semiconductor fabrication processes and technologies. • Prior related work experience within a semiconductor foundry.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
784 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0283361
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