Packaging Module Development Engineer

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Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer.
In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies.
Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements.
Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment.
Other Job scope: • Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies • Plan and conduct comprehensive DOEs to fundamentally characterize process window and understand process / equipment / materials / chemistry interaction. • Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity • Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.
Strong analytical and problem-solving skills.
Work with ambiguity in a fast paced, constantly changing product roadmap environment Self-initiative, action-oriented by influencing, written and verbal communication skills with the ability to work independently.
Flexibility in changing priorities and responsibilities to support business needs.

to be initially considered for this position.
Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.
Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum qualifications The candidate must have a Bachelor’s degree in Biomedical Engineering Materials Science and Engineering, Chemical Engineering, , Mechanical Engineering, or related engineering degree or any related STEM degree.
OR Master’s degree in the same fields.
Minimum 3+ months of experience as a combination of the following: Circuit assembly, embedded programming.
Engineering programming skills in tools like Matlab, Python and CAD Modeling.

Experience with commercial Mechanical and/or CFD modeling tools like Comsol, Fluent, Ansys, or similar.
Semiconductor and/or packaging processing.
Programming/script development with artificial intelligence and machine learning concepts.
Demonstrated ability to work seamlessly between experiments and simulations.
It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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