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About This Role
- Join Intel's Advanced Packaging Technology Development organization as a Packaging Module Development Engineer.
- In this critical role, you will drive the development and optimization of processes and equipment that enable Intel's future assembly packaging platform technologies.
- Your contributions will directly impact the manufacturability and reliability of next-generation products, ensuring Intel remains a leader in advanced IC packaging solutions.
- You will collaborate with cross-functional teams to develop innovative methods, solve complex engineering challenges, and design processes to meet quality, cost, yield, and productivity targets.
- This is an opportunity to shape the future of packaging technology while working within a dynamic and supportive environment that values creativity and collaboration.
- Key Responsibilities - Develop and optimize panel-level processes and equipment to enable Intel's advanced packaging technologies. - Characterize process windows using principles of design of experiments (DOE) and analyze interactions among equipment, materials, and processes. - Establish equipment configurations, process specifications, and workflows for new technologies, integrating them into production. - Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity. - Develop and maintain equipment capable of testing silicon and package technologies under simulated field conditions including heat, humidity, temperature cycling, and dynamic forces. - Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet stringent quality standards. - Lead efforts to develop novel techniques, methods, and tools to accelerate technology maturity and identify risks early in the product development cycle. - Document advancements and improvements through technical white papers and data analysis reports. - Partner with engineering teams and external stakeholders to address packaging challenges, ensuring alignment with Intel's roadmap.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
- Minimum Qualifications MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field and 4+ Years Relevant Experience.
- OR PHD degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field and 2+ Years Relevant Experience The experience listed above should be a combination of the following: Experience in electrochemistry, electrolytic and/or electroless processes.
- Preferred Qualifications - Experience with process development, equipment adjustment, and manufacturing process control. - Proficiency in design of experiments (DOE) principles and statistical data analysis. - Experience in process characterization and statistical process control. - Familiarity with materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM. - Strong analytical skills and experience troubleshooting integrated technology issues. - Proficiency in statistical tools, process control frameworks, and Microsoft Office software suite applications. - Experience working with organic and inorganic materials in packaging processes.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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765 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-ENgineer_JR0283276
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