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About This Role
- The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies.
- The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel’s roadmap for advanced packaging and Thermal Compression Bonding technologies.
- They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability.
- Key Responsibilities Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques.
- Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations.
- Documents technical findings and improvements through white papers, reports, and qualification summaries.
- Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs.
- Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.
- Supports standardization of metrology methods, and works closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones. Qualifications: You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position.
- Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Minimum Qualifications Bachelor's degree with 4+ years or Master's degree with 3+ years, or PhD with 1+ years of relevant experience in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline. 1+ years of Hands-on experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment. 2+ years of knowledge of measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility. 2+ years of experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods. 2+ year of experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision. 2+ years of working knowledge of data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting.
- Preferred Qualifications Experience in semiconductor manufacturing, preferably in advanced packaging.
- Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.
- Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability.
- Experience with machine vision systems, automated inspection, or camera-based measurement techniques.
- Familiarity with lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies.
- Experience with DOE, correlation analysis, and method optimization for metrology or test systems.
- Knowledge of quality systems, measurement documentation, and standardization of metrology methods.
- Experience working with suppliers, vendors, or external calibration/measurement service providers.
- Demonstrated ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes.
- Join us at Intel to contribute to technological advancements while building a rewarding and impactful career.
- Apply now to be a part of our extraordinary journey.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
Open roles at Intel
612 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0286214
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