Packaging Module Development Engineer

About This Role

• The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
• Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
• As a Packaging Module Development Engineer, you will. • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. • Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities • Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. • Manage projects to ensure alignment with product development schedules and execution milestones. • Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. • Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments • Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate will demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills.
• This position requires regular onsite presence.