Packaging Module Development Engineer

About This Role

• Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies.
• This role involves working in close collaboration with packaging assembly module teams, package architecture, integration, and assembly, substrate, an optical component materials supply chain, as well as semiconductor vendors and assembly/test providers worldwide.
• The position requires a strong understanding of optical materials and assembly process, optical component design, manufacturing, and test, active optical alignment processes.
• This role spans across pathfinding through high volume manufacturing for successful integrated co-packaged optics packages.
• In this role, the individual will be responsible for, but not limited to: Conducting fundamental studies and performing experiments to characterize materials, identify potential failure modes, understand the structure-property-performance interactions, assess feasibility of material use on product, and make material technology recommendations.
• Working in close collaboration with materials suppliers to develop and source materials formulations that meet technology, quality, availability, and cost targets.
• Developing a fundamental understanding of Intel's assembly process and materials interactions and impact on product performance.
• Collaborating closely with Materials, equipment and process engineering teams to build material technologies on test vehicles and products and assessing their performance.
• Develops materials assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Develops new techniques and metrologies, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• The candidate should also exhibit the following behavioral traits and/or skills: Technical problem-solving, strong presentation and communication skills, fast-learning skills and solid expertise in their technical field, willingness to collaborate effectively as a team player across multiple teams.