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About This Role
- Board Assembly Technology Development (BATD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer product assembly needs and certify Surface Mount Technology (SMT) manufacturing for new Central Processing Unit (CPU), Chipset, System on Chip (SoC) BGA packages, and Socket Technology.
- The Board Assembly Technology Development Lab in Kulim, Malaysia, offers SMT manufacturing, provides expertise in technology development, enabling next-generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials.
- In this role, you will be a Packaging Module Development Engineer focuses on process technology development for SMT processes.
- Your responsibilities will include developing SMT process solutions and recommendations for Intel's integrated circuit (IC) packages and sockets to support new IC package development.
- What you will do: As a Packaging Module Development Engineer, you will be tasked with developing and validating board assembly process solutions to meet Intel's next-generation product requirements.
- Your responsibilities will include creating SMT process solutions for Intel IC packages and sockets, identifying and addressing root causes of defects in SMT process development.
- You will also be responsible for SMT Process Development.
- Design and optimize SMT processes, including stencil design, solder paste selection, reflow profiling, and inspection criteria to ensure high yield and reliability.
- Testing of prototype boards, utilizing advanced equipment such as X-ray inspection and automated optical inspection (AOI) Data Analysis: Utilize statistical tools and software to analyse process data, identify trends, and drive continuous improvement initiatives.
- Documentation and Training: Develop detailed process documentation and provide training to manufacturing teams to ensure consistent implementation of new technologies.
Requirements
- Possess a Bachelor's degree or Master's degree in Mechanical Engineering or Materials Science or Chemical Engineering, Mechatronic, Applied Physics or a related engineering field.
- Experience in or conduct project/assignment in data analytic, statistical analysis.
- Experience in any SMT or printed Circuit Board Assembly (PCBA) processes is an added advantage.
- The candidate should exhibit the following behavioral traits and/or skills: Self-starter, detail orientated, discipline and good in communication.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
765 positions
Job ID
/job/Malaysia-Kulim/Packaging-Module-Development-Engineer_JR0283634
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