Packaging Module Development Engineer

About This Role

• Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
• Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
• Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.