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About This Role
- As a Packaging Equipment Development Manager, you will drive innovation and excellence in semiconductor packaging processes, equipment and technologies within Intel's dynamic assembly environment.
- In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.
- Your leadership will directly impact Intel's ability to deliver cutting-edge products to customers, shaping the future of semiconductor technology.
- You will be part of Intel's Assembly Technology Development (ATD) organization, which plays a pivotal role in advancing assembly capabilities.
- This group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production.
- By joining this team, you will contribute to Intel's mission of delivering transformative technologies that fuel global progress Key Responsibilities Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.
- Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM).
- Manage strategic and tactical decision-making for module engineering activities, ensuring alignment with Intel's operational goals.
- Collaborate with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges.
- Develop long-term strategies for equipment capabilities to support future requirements.
- Provide mentorship to engineers, fostering technical expertise and leadership within the team.
- Ensure team accountability and drive results through effective goal setting, performance management, and collaboration.
- Champion Intel's values, creating an inclusive and productive work environment.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Minimum Qualifications Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or a related field, with 9+ years of relevant experience.
- OR- Master's degree in the above fields with 6+ years of relevant experience.
- OR- PhD degree in the above fields with 4+ years of relevant experience.
- Demonstrated experience in equipment development and process integration for semiconductor packaging.
- Proficiency in statistical methods, experimental design, and data analysis.
- Preferred Qualifications 5+ years of semiconductor assembly process technology development experience. 3+ years of people management experience, including mentoring and team leadership.
- Expertise in dispense, thermal, plasma equipment development, or related fields.
- Strong problem-solving skills and familiarity with assembly equipment development methodologies.
- Ability to create and execute equipment solution roadmaps, guiding external suppliers to develop industry-leading technologies.
- Join our innovative team and play a key role in developing cutting-edge solutions that drive the future of semiconductor technology.
- Your expertise and leadership will help Intel deliver world-class products that shape our industry.
- Apply today to become a vital part of our journey.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
627 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Equipment-Development-Group-Lead_JR0286442
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