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About This Role
- Intel is shaping the future of technology to help create a better future for the entire world.
- Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations.
- With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.
- Join us and help make the future more wonderful for everyone.
- Life at Intel APTD LYA is a Foundry Labs Network organization that supports back-end package assembly and wafer level assembly sort and test fails to help root cause yield loss and in-line failures.
- In this electrical-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and characterization of assembly technologies.
- Engineers on back of week shift schedules will help bridge support between shift engineering technicians, as well as shift 1 engineers and module partners, yield support, integration and both internal and external customers in a collaborative environment.
- As an LYA Engineer, you will set priorities for the platform/project, get results across boundaries, and ensure an inclusive work environment.
- In this role, engineers can expect to work with a team of engineers and engineering technicians to conduct various analyses and engineering tests to provide platforms with root cause determination of in-line electrical failures and perform defect and/or process characterization in support of identifying key mechanisms that contribute to RC identification.
- This position requires a shift 7 (back half days) schedule on a compressed work week.
- Shift 7 is: Compressed Days Back 2, 3, or 4 day workweek that begins in the second half of the week.
- Your main responsibilities include, but are not limited to: - Working across team boundaries to achieve strategic objectives and meet program deliverables. - Understand program milestones and schedules then translate into team objectives and drive execution. - Interface with a wide variety of internal teams, as well as external suppliers to improve yield and drive innovation. - Project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, as well as various other electronic components and/or completed units. - Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions and/or fixes to internal customers. - Develop failure analysis innovative techniques, BKMs, and/or approaches to accelerate failure identification and mechanism understanding. - Provide consultation concerning packaging and/or assembly problems and improvements in the manufacturing process. - Respond to customers' requests or events as they occur. - Candidate should be capable of working effectively across organizational boundaries. - Candidate must exhibit the following traits/skills: Work with ambiguity and flexibility with respect to job roles and working hours, have strong analytical and problem-solving skills, and possess robust communication and presentation skills.
- This role is lab-based and on-site required.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Experience listed below would be obtained through schoolwork and/or classes and/or project work and/or internships and/or military training and/or work experience.
Requirements
- Must possess a Master's Degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field. 3 + months experience with electron microscopy tools or other characterization or fault isolation tools. (such as SEM, TEM).
Nice to Have
- Prior experience working in a lab environment. • Experience with destructive and optical analysis techniques such as manual cross-sectioning and delayering, SEM, x-ray, microscopy, CSAM, ion milling, TEM and FIB • Experience performing electrical fault isolation and failure analysis on product and TV through the use of hand probe, curve trace, auto probing, TDR, EOTPR, EBAC, RIDR, and/or ELITE. • Experience with chemical compositional analysis techniques such as EDX.
- AFM, FTIR, Raman, and diffraction techniques such as XRD and EBSD. • Knowledge of package or die mapping software EX: Mentor Graphics, SysNav/CadNav, FIELD and expertise in SQL scripting and basic statistical analysis tools such as JMP are a plus. • Ability to communicate findings verbally and through reports to yield engineers, LYA analysts, and other customers. • Ability to work in a collaborative manner with a variety of different individuals in a fast paced, technical environment. • Ability to work effectively in an ambiguous environment where changing priorities and the norm.
- Benefits at Intel Our total rewards package goes above and beyond just a paycheck.
- Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals.
- Go to Intel Benefits | Intel Careers for details of benefits available to you.
- Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $99,030.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
784 positions
Job ID
/job/US-Arizona-Phoenix/Package-Assembly-Low-Yield-Analysis-Engineer_JR0283677
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