Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)

Requirements

• Must be actively pursuing a PhD degree in Materials Science Engineering, Physics, Chemistry, Electrochemistry or Chemical Engineering 3+ months of educational, research, laboratory, internship, or industry experience.
• Demonstrated hands-on experience through academic research, laboratory work, internships, coursework, or technical projects.
• Basic understanding of semiconductor manufacturing processes, process integration, or advanced manufacturing methodologies.
• Preferred Qualifications Experience with data analysis, statistical methods, and process optimization techniques.
• Strong academic performance with a cumulative GPA of 3.0 or higher preferred.
• Demonstrated deep expertise in chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion/passivation mechanisms, or surfactant-assisted cleaning/drying mechanisms (e.g., Marangoni drying, supercritical CO2).
• Hands-on experience with advanced thin-film, surface, and chemical characterization techniques (e.g., Ellipsometry, AFM, SEM/TEM, XPS, contact angle goniometry, FTIR, TXRF, or ICP-MS).
• Experience with automated fluidic systems, wet processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics/mass-transfer troubleshooting.
• Demonstrated experience utilizing Python, MATLAB, JMP, or Machine Learning for design of experiments (DOE), multivariate statistical analysis, or process automation.
• Strong publication record, conference presentations, or filed patent applications demonstrating systematic problem-solving in experimental chemical and materials science.
• Take the next step in your career journey by joining a collaborative, innovative team where your contributions will help shape the future of semiconductor technology.