Module Engineer On Shift (MEOS)

About This Role

• Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence.
• With decades of engineering excellence and a commitment to pushing the boundaries of what's possible, Intel develops the technologies that power everything from personal devices to data centers and AI systems.
• At Intel, we believe in the power of human ingenuity — and we're looking for bold, curious minds to help us build what's next.
• Are you passionate about semiconductor innovation and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts.
• In this role, you will be at the forefront of developing and optimizing cutting-edge assembly and packaging processes that directly influence the quality, reliability, and performance of Intel's next-generation semiconductor products.
• This is an exciting opportunity for an early-career engineer who is eager to apply their academic knowledge in a world-class manufacturing and engineering environment, contribute to meaningful projects, and grow alongside some of the brightest minds in the semiconductor industry.
• Shift Information This role operates on Shift 4: 6:00 PM – 6:00 AM on an alternating weekly schedule: (nights frontend) Sun-Tues and alternating Saturday nights Key Responsibilities: Design and develop assembly packaging processes and equipment to enable next-generation semiconductor technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to create and refine process and equipment specifications.
• Conduct tests under simulated field conditions — including heat, humidity, and dynamic forces — to evaluate silicon and package technologies.
• Oversee the manufacturability of package designs and manage the full lifecycle of packaging processes, procedures, and workflows.
• Collaborate with suppliers and procurement teams to establish material specifications and ensure compliance with quality and performance standards.
• Develop innovative techniques, tools, and quality screens to identify packaging quality and reliability issues early in the development cycle.
• Set reliability standards based on a deep understanding of failure mechanisms, influencing design, material selection, and process development.
• Provide technical consultation and support for packaging process improvements while responding to internal customer and client needs.
• Drive standardization in product qualification, manufacturing quality systems, and engineering practices, ensuring alignment with key product milestones.
• As a Successful Candidate, You Will Bring: Curiosity & Eagerness to Learn – You have a growth mindset and are always looking to deepen your knowledge and skills.
• Collaborative Spirit – You thrive in cross-functional team environments and build strong working relationships with colleagues, suppliers, and stakeholders.
• Problem-Solving Mindset – You approach challenges analytically and creatively, finding solutions even in ambiguous situations.
• Attention to Detail – You take pride in precision and accuracy, especially when working with complex processes and specifications.
• Effective Communication – You can clearly articulate technical concepts to both technical and non-technical audiences.
• Adaptability – You are comfortable navigating a fast-paced, dynamic environment and can manage shifting priorities with ease.
• Ownership & Accountability – You take initiative, follow through on commitments, and hold yourself to a high standard of quality.
• Ready to shape the future of semiconductor technology? Apply now and join Intel's Epoxy MEOS team in Arizona, where your ideas, passion, and engineering expertise will help power the world's most advanced technologies.