Module Development Engineer, Defect Inspection

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About This Role

  • About the Role Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection , where you will help enable next-generation semiconductor innovation.
  • In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes.
  • You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.
  • What You’ll Do Key responsibilities will include but not limited to: Develop and implement defect inspection and metrology technologies for semiconductor manufacturing.
  • Design and optimize processes, inspection methods, and equipment performance.
  • Conduct process experimentation and feasibility studies using statistical and engineering methods (DOE, SPC).
  • Collaborate with equipment and materials suppliers to introduce new technologies.
  • Analyze defect data to identify root causes and improve yield and quality.
  • Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
  • Support technology pathfinding and roadmap development for next-generation products.
  • Stay current with industry trends, emerging tools, and inspection methodologies.
  • Behavioral traits that we are looking for candidates who: Collaborate effectively across teams and disciplines Show curiosity and continuous learning mindset Demonstrate strong analytical and problem-solving skills Can adapt to changing priorities in a dynamic environment Communicate technical concepts clearly to diverse audiences Take ownership and accountability for results Drive innovation while maintaining attention to detail Why Join Us Work on cutting-edge semiconductor technologies Opportunity to influence high-volume manufacturing and future nodes Collaborative, inclusive, and innovation-driven environment Career growth through challenging technical opportunities Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
  • See Intel Benefits for more details.

Requirements

  • to be initially considered for this position.
  • Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
  • Immigration Sponsorship Information Minimum Qualifications and Experience : Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience.
  • Or a Master's degree in the same field with 3+ years of experience and a PhD in the same field with 2+ years of experience.
  • Your experience described above must be in the following: Semiconductor processing, system controls, opto-mechanics, or mechanical systems.
  • Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Preferred Qualifications and Experience : Demonstrated ability to troubleshoot manufacturing processes and equipment.
  • Experience with packaging processes, equipment automation development, or project management in technology development.
  • Previous related work experience in a semiconductor foundry preferred We invite you to bring your expertise and creativity to Intel, where you will have the opportunity to innovate, collaborate, and shape the future of semiconductor technology.
  • Apply now and become an integral part of our dynamic team.

Benefits

  • We offer a total compensation package that ranks among the best in the industry.
  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel .
  • Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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Intel

US, Oregon, Hillsboro

Specialisation
Open roles at Intel
101 positions
Job ID
/job/US-Oregon-Hillsboro/Module-Development-Engineer--Defect-Inspection_JR0283793

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